Please enter text.

Why Investing in Solder Paste Inspection Equipment is a Wise Decision

 Jun 30, 2015

Solder Paste Inspection Equipment

In Surface Mount Technology (SMT), solder paste deposition is a vital process in board assembly operations. This process is prone to defects and errors during the manufacturing process. Defects can be found either in the solder paste itself, or in the solder printing process. Fixing defects can be very time consuming, resulting in material wastage, extra expenditure, and excessive downtime. However, this is not the end. There is one sure-fire way to solve solder defects in PCBs – Solder Paste Inspection (SPI).

What is Solder Paste Inspection?

As the name suggests, this process involves using specialized inspection equipment to test solder paste deposits. SPI equipment can help measure solder pad volumes, so that the right amount is used in the solder printing and application process.

What Benefits can Be Accrued by Using SPI Machines?

There are a number of advantages that PCB manufacturers as well as customers can receive by using SPI equipment for PCB soldering:

  • It is an efficient method to control solder printing processes.
  • SPI gives manufacturers the opportunity to identify solder joint defects at an early stage and solve the issue instantly. This can help manufacturers and customers save on excess expenditure.
  • The SPI process can be performed before any of the solder is melted, or before any component is placed on the circuit board.

Why Should SPI be Given Importance?

Choosing to invest in SPI machines can help solve major problems related to solder joint application and defects. The following points justify the relevance of this process:

  • Most PCB defects are connected with the solder paste printing process.
  • Measuring solder paste volume can allow the manufacturer to predict the quality and long term reliability of solder joints.
  • By using SPI, excessive expenditure can be avoided in areas like post reflow processes and in-circuit testing.
  • Process control can result in the production of reliable fine pitch devices.
  • SPI allows for exact measurement of the height of the solder paste in the printing process. This can lead to a reduction in density of electric components. It can also support the miniaturization of the components.
  • Tight control over the assembly process will enhance the durability of the products, while giving the manufacturers a definitive edge in the PCB market.

The above information proves that investing in SPI equipment is a wise decision. Integrating SPI as part of the PCB manufacturing process can provide immense benefits for organizations and customers alike. For more information about Solder Paste Inspection, please visit Contact:

PCB Assembly Quote