Mixed Technology Assembly Services

Mixed technology PCBA is a combination of through-hole and surface mount assembly on a single board to optimize performance, space, and mechanical strength. Ideal for applications requiring both power-handling and high-density miniaturized components, it supports complex multilayer designs and enhances electrical reliability and thermal management. At Accelerated Assemblies, we offer tailored mixed technology PCB assembly services for single-sided, double-sided, and multilayer boards, meeting diverse industry needs. Our solutions accommodate components of various sizes and functions, ensuring performance efficiency and durability in demanding environments. This approach enables manufacturers to meet evolving design challenges with robust, high-quality circuit board assemblies.

• Completely Automated Assembly Equipment: We utilize fully automated pick-and-place systems, soldering stations, and inspection tools to streamline the mixed assembly process and reduce human error, ensuring consistent high-quality results.
• Automated Flux Dispensing and Laser Sighting: Precision-controlled flux application and laser-guided component alignment increase process accuracy, particularly for complex multilayer and high-density boards.
• Fast and Accurate Placement Machines for Thin, Small-Sized, Lead Components: Our placement systems handle a wide range of package sizes and lead types, allowing us to manage ultra-small pitch components efficiently.
• High-Speed Production of Densely Populated Assemblies: We are equipped to handle boards with intricate routing and a high number of components, minimizing cycle times while maintaining quality.
• Wave and Selective Soldering Machines: These machines allow for reliable soldering of through-hole components, especially beneficial for power electronics and connectors, without damaging SMT components.
• Automated Multi-Stage Aqueous Cleaning: Our cleaning systems remove ionic and non-ionic contaminants after soldering, enhancing long-term reliability and reducing risk of corrosion.
• Automated Optical Inspection (AOI): AOI systems inspect component placement, orientation, and solder quality to detect even the smallest defects early in the assembly process.
• X-Ray Inspection: X-ray imaging ensures proper alignment and soldering of hidden joints, such as BGAs, where traditional inspection isn't feasible.
• Chassis Wiring and Assembly: We provide complete electromechanical integration, including chassis assembly, harnessing, and final system-level integration for turnkey solutions.
• Functional Testing: Customized electrical and functional tests validate the performance of the board in real-world applications, ensuring zero-defect delivery.
• Quick Turn Prototype and Production Builds: Whether you're at the prototyping stage or ready for volume production, we provide quick turnaround times to help you meet tight schedules and project milestones.

• Design Versatility: Combining SMT and THT components helps achieve complex layouts and accommodate a broader range of electrical and mechanical functions.
• Enhanced Reliability: Through-hole connections provide added strength, especially for connectors or high-stress components, making the board more robust under demanding conditions.
• Optimized Space Utilization: SMT components can be placed on both sides of the PCB, freeing up space, while through-hole components add structural stability.
• Cost-Efficiency in Manufacturing: Mixed technology enables the integration of low-cost components where needed, balancing performance and cost effectiveness in high-volume builds.
• Improved Electrical Performance: Combining component types allows for better signal integrity, reduced parasitics, and optimal heat dissipation.

• Automotive Electronics: For modules such as ECUs, infotainment systems, and ADAS, where robust connections and compact size are both crucial.
• Aerospace and Defense: High-reliability PCBs used in mission-critical systems such as avionics, radar equipment, and satellite subsystems.
• Telecommunications: Routers, switches, and network infrastructure hardware demand high-speed performance with reliable signal integrity.
• Industrial Controls and Automation: PLCs, motor controllers, and HMIs that need rugged assemblies with long operational lifespans.
• Power Electronics: Applications such as inverters, converters, and power supplies where high current-handling and thermal management are priorities.