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Data Communications

Strengthening Communication Connections with PCB Assemblies

Since its inception, Accelerated Assemblies has been a major quick turn solutions provider for the data communications industry. We have the capabilities to provide printed circuit board assemblies of varied designs, volumes, and capabilities to meet customer requirements.

PCB Assembly Solutions for Data and Communication Applications

At Accelerated Assemblies, we design and manufacture printed circuit board assemblies for dense RF communication applications. A variety of materials can be chosen to meet your specific requirements. Generally, we recommend high grade fiber optics, PTFE, polyimide, and fiberglass, amongst others.

We design complex BGA and micro BGA assemblies using surface mount and plated through hole technologies. For custom products, we have the capabilities to provide SMOBC and a combination of SMT and PTH assemblies. We utilize the selective wave soldering process to ensure precision in manufacturing as well as to avoid damage to fine pitched components. We can also produce assemblies with the following processes:

  • Lead free soldering
  • Lead based soldering
  • RoHS compliant process

We process CAD data, employ placement machine programs, and utilize various test procedures to substantiate the quality and performance of our PCB assemblies with customer expectations. Accelerated Assemblies performs Automated Optical Inspection (AOI), as well as functional and In-Circuit Testing (ICT) to ensure that the products are of high quality. Our testing criteria includes, but is not limited to DFM analysis, power consistency, thermal limits, and signal integrity.

Other capabilities and services provided by Accelerated Assemblies include:

  • Aqueous and no-clean solder chemistry
  • Box build assemblies
  • Potting and conformal coating
  • Multiple, linked, and continuous flow production lines

All our products conform to the regulations laid down by UL, and RoHS 5 and 6. Our production quantities are shipped to customers in 7 working days. If you would like to know more about our products and capabilities, please contact us via telephone at +1(630)616-6680 or email to info@acceleratedassemblies.com

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BLOGS

Wave Soldering Defects: Common Causes and Practical Solutions for Reliable PCB Assembly
 Aug 24, 2026
 Acceleratedassemblies
 Wave Soldering
Wave Soldering Defects: Common Causes and Practical Solutions for Reliable PCB Assembly

Wave soldering remains one of the most widely used PCB assembly processes for through-hole and mixed-technology circuit boards. It offers a fast, repeatable method for creating electrical and mechanical connections across large production volumes.

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Lead-Free PCB Assembly: Materials, Process Considerations, and Surface Finishes
 Aug 19, 2026
 Acceleratedassemblies
 lead-free PCBs
Lead-Free PCB Assembly: Materials, Process Considerations, and Surface Finishes

As environmental regulations tighten and sustainability initiatives gain momentum, lead-free PCB assemblies are gaining traction across consumer, industrial, automotive, and medical electronics.

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PCB Design for IC Integration: Key Considerations and Challenges
 Jul 22, 2026
 Acceleratedassemblies
 PCB Design
PCB Design for IC Integration: Key Considerations and Challenges

Modern electronic devices are becoming smaller, faster, and more powerful, increasing the need for efficient integrated circuit (IC) integration in PCB designs.

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High-Frequency PCB: Core Design Techniques for Signal Integrity and Stability
 Jul 15, 2026
 Acceleratedassemblies
 RF PCB
High-Frequency PCB: Core Design Techniques for Signal Integrity and Stability

High-frequency electronics are used in advanced systems that operate at GHz-level signal speeds, where PCB performance becomes highly sensitive to design precision.  As operating frequencies increase, even minor variations in layout, materials, or routing can have a measurable impact on overall sign...

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PCB Stackup Design Guide: How Layer Stackup Affects Signal Integrity
 Jun 23, 2026
 Acceleratedassemblies
 PCB Stackup
PCB Stackup Design Guide: How Layer Stackup Affects Signal Integrity

PCB layer stackup is one of the most important decisions in high-performance board design. For OEMs developing products with high-speed interfaces, strict EMI requirements, or dense routing, stackup planning directly affects signal integrity, power delivery, impedance control, and manufacturability....

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See what our customers says

"We REALLY appreciate the fantastic job that Accelerated Assemblies does for us. We are glad to have found a great, long term partner and we look forward to our businesses growing together. "

- Peoria, IL

"The boards came in today and they look great. Everything is working perfectly and the way you have all helped us through this challenging project says a lot about the quality of your people and company. "

- Minneapolis, MN
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