BGA Assembly Services
The Premier Destination for BGA Assembly Services
Accelerated Assemblies has immense expertise in Ball Grid Array (BGA) assemblies. We provide BGA assembly services that are well-known among clients for producing quality circuit boards with precision component placement and soldering excellence.
BGA Assembly Service Features
We offer the entire gamut of Assembly services for BGAs, including:
- Ceramic BGA (CBGA)
- Plastic BGA (PBGA)
- Micro Fine Line BGA (MBGA)
- Micro BGA
- Stack BGAs
- Leaded and Lead free BGAs
We provide these with ultra-fine pitch quad flat packages (QFP), Quad Flat No Lead Package (QFN), and Chip Scale Packages (CSP). We analyze BGA data sheets, BGA size and ball material composition. We optimize the thermal profile of the BGAs to improve the quality of the assembly process.
We utilize the latest equipment in automated Surface Mount Technology (SMT) assembly to help us meet this goal:
- Automated Placement Machines
- Automatic Solder Dispensing Machine
- Reflow Oven
- X-ray and AOI Inspection Systems
- Specialized Inspection Systems for solder ball height and coverage
An ESD and climate controlled environment is also utilized to ensure that the finished products meet all standards of efficiency, reliability, and quality.
Review and Rework Services
Apart from these, we can also provide rework and reballing services for BGAs that are already in use. Our rework and reballing capabilities include BGA removal and replacement, rework of ceramic and plastic BGAs and reballing of MBGAs. Our BGA rework process comprises:
- Component removal
- Preparing the rework area
- Solder paste application
- Replacement of BGA
- Reflow of circuit board
Our rework processes are guaranteed to protect the circuit board from any future damage.
Accelerated Assemblies becomes a one stop destination for all your BGA assembly services. Contact us to know more.